The XPand1015 system is a low-cost development platform for conduction-cooled 6U VPX cards. 0 in. 8, for 3U and 6U VPX module-based systems to overcome SWAP-C (size, weight, power and. Ideal for SBCs or carriers for VPX, VME and cPCI (Compact PCI/PCIe or PXI) - Commercial or Rugged/Conduction Cooled Systems. (H) Four 0. A common example of this is the conduction cooled chassis mounted onto a cold plate as shown in the below figure. The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). VITA 91 high-density connectors allow for a completely switched backplane. The XPand1201 is a low-cost, flexible, development platform. Board Example: WILDSTAR UltraKVP ZP 3PE for 6U OpenVPX (WB6XZ3) has an operating temperature of –40˚C. A hybrid switch with 24 ports 32 lane PCI Express Gen 1 / Gen 2 and additional 9 port Gigabit Ethernet switching capabilities provides for highest bandwidth. 3U Open VPX, MOD3-SWH-2F24U module; Air-cooled - Backplane: 22x 10GBase-KR, 1x 10/100/1000Base-T user configurable front panel or backplane. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. Products. It offers multiple pickets mixed with the DDS and fixed VCOs mixed with the wideband DDS. or 1. Fast backplane replacement makes for easy reconfiguration in support of every stage of development. 2) modules. With dual PowerPC e600 cores running at up to 1. The . 3U and 6U VPX mass storage module using the latest NVMe and SATA SSDs. 85" pitch ver-sion allows for the top and bottom coversDesigned specifically for high-powered, conduction-cooled modules, the AVRO-2 is a compact solution in a 2-slot 3U VPX chassis. It can. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. 2) modules. 03/12/2021. This allows testing of the conduction cooled modules without going through the thermal chamber. VPX 3U/AC Power Supply 600W. DescriptioN sa - staNDarD commerciaL vX3920 vX3920-sa-B1a00 3U VPX 10/40 GbE Switch, full managed L2, L3, QoS, Multicast, IPv6. Form Factor: 3U VPX Ethernet: 2 10GBASE-T, 4 10/100/1000BASE-T USB: 2 USB 2. 0 in. 48. 1 switch and 10G backplane Ethernet switch in a single 3U module, enabling you to connect between a wide range of module types – including those with earlier Gen 1 or Gen 2 PCIe interfaces. NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX SBC. 1, titled “VPX Conduction Cooling: Frame Construction,” extends the VITA 48. They are low-power system-on-chip (SoC. 0. Front Panel: 2x 10G SFP+. The design incorporates a Blu-Ray drive, SBC, Power Supply and ECS (Environmental Control System). wedgelocks are utilized to secure conduction-cooled pcb modules in deployed system level, embedded electronics enclosures. 8. The RFDC is a 1 inch pitch, conduction cooled, VPX circuit card assembly per VITA 48. The conduction-cooled module version of VPX-REDI (Figure 3) can be on either a . or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. 8 are already available, such as this 3U VPX COTS system with air-flow-through cooling. VP32004 - LinkedHope Intelligent Technologies Co. This extensive line includes conduction cooled VPX, air cooled VPX, as well as VPX ATR configurations. 0 standard by specifying additional mechanical details related to the frame construction of conduction-cooled modules. 2 chassis, heat is conducted away from hot module components through the heat sink and out to the module wedge locks. 2 RS-232, 2 RS-232/422/485 Chassis Type: Sub-½ ATR Number of Slots: 2 Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. Air flow from bottom to top (Other options available on request) Standard 3U rear transition module. It provides guidelines for constructing the frame, which is an essential part of the conduction-cooled module’s thermal. Designed to meet the requirements of VITA 62 for use in harsh environments. com 30765 Wixom Rd, Wixom, MI 48393 USA INTRODUCTION TO VPX: VITA 46, 48, AND 65: THE NEXT GEN VME SYSTEM REPLACEMENT 4The V1160 is built from the ground up for rugged and harsh environments. (W) x 5. Rugged Conduction Cooled Assemblies and Modules. TR E8x/msd-RCx – Rugged 3U VPX Processor. 3U Switch. 0 in. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. Input: 80 to 264V AC. Single-slot 6U VPX form factor Dimensions: 233 mm x 160 mm x 25. The XPedite7477 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset. Form Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. VMEbus International Trade Association, 2010. Accommodating cooling methods that include forced air, conduction, and liquid. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. Three tri-color front panel LED’s to. XMC slot. Fax: (604) 875-5867. 3U VPX Test Module performs a wide variety of functions and applications such as: Compliance testing of VITA Rules for OpenVPX conduction cooled systems; Design Validation of systems based on Power and Thermal simulation of deployed board set; Emulate system operating current profile based on multiple current image mapping of. 8 in. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling” was developed and promoted by a working group sponsored by Lockheed Martin,. The XChange3030 delivers full wire-speed across all. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 2 conduction cooled configuration and ready for rugged applications. Operating Temperature Range Storage Temperature Range; Min Max Min Max; AC1: Air Cooled Industrial-40°C +70°C-55°C +100°C: CC1: Conduction Cooled Industrial-40°C +70°C-55°C +100°C: Operating Humidity Range: Up to 95% (non-condensing) EMC: FCC 47CFR Part 2FPGA, 19 Zoll, Nvidia Jetson, CPCI, VPX air cooled, VPX conduction cooled, MicroTCA, Ip-Core, and NVME SSD Locations Primary Industriestraße 10. These rugged power supplies are available in 200W-1300W power configurations. 2 / VPX conduction cooled thermal load board module. The VTX985 is a dual slot 3U VPX chassis conduction cooled for two 3U VPX modules. Visit Product page. It is designed to work as the system controller in command, control, communicate and compute applications and has a wide range of interface and storage options. OC-CC-VPX-3U-5HP-SS-300-LB48 WT ASSY # - 43094 3U VITA 48. 3U VPX with NVIDIA Jetson AGX Xavier Industrial and ConnectX-6, SOSA aligned Payload profile module for HPC tasks such as sensor data processing, machine vision, and other C4ISR tasks. Systems based on ANSI/VITA 48. Slots. The Ruggedized Enhanced Design Implementation (VPX-REDI) lays out the mechanical design requirements for forced-air cooling, conduction cooling, and liquid cooling in VPX modules, providing detailed. Compare. 1/2 ATR, conduction-convection cooled. As cards reach up to 170 W densities, they are exceeding the single-slot capability that a conduction-cooled card can handle, especially when several of these high-powered cards are used in adjacent slots in a system (depending on. VPX-XMC Conduction-Cooled Adapter Assembly . Capacities currently up to 20 TB. XPand1007. Rugged Conduction Cooled Assemblies and Modules Conduction Cooled Assemblies and Modules Conduction Cooled Keys Systems and Components. LCR Embedded Systems. Expansion Plane. The VPX-REDI specifications of VITA 48. Conduction cooled card guide for Dawn DC- (n) Series air cooled development chassis. 2) VPX router serves as an aggregation point for on-demand network connectivity in mobile or fixed deployments. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. Ideal for rugged deployed, mobile applications. 3"H Chassis Cooling: Conduction-Cooled Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O 1 * Kintex® UltraScale™ FPGA. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. With a Core 2 Duo processor at up to 2. Embedded RuSH TM technology. A Tour of VITA AFT Cooling Standards in 2023 For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches. The 7-slot air-cooled Chassis and Backplane incorporates slots for up to four conduction-cooled 3U VPX Payload Boards, plus a 100GbE Switch, SBC, and VITA 62 power supply, delivering up to 700W. Also Available: A rugged ATR versionFeatures. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. It supports up to two 0. It supports up to two 0. SATA, PCIe, and NVMe interfaces. It supports 3rd Gen Intel Core series processor and Intel QM77 chipset. Conduction Cooled Chassis » Two Intel® Core™- i7 processors with integrated DDR3 Memory Controller » 25% improvement in performance,CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled. 2) VPX router serves as an. NIM / CAMAC Power Supplies. Max 10. The ANSI Standard ANSI/VITA 48. Most VPX systems make use of VITA 48. The first100GbE 3U VPX SBC on the market aligned to SOSA 1; Up to 256 GB M. Air, Conduction. Load sharing circuitry for up to 4 modules. SE306S-CCVPX- Conduction 6 SSD XMC Yes 6 GB/s 12TB No StoreEngine 3U Air Cooled VPX SE300‐VPX‐ND accomodates standard I/O XMCs StoreEngine 3U Conduction Cooled VPX SE300‐CCVPX‐ND accomodates standard I/O XMCs via a removable front panel/heat frame element StoreEngine 3U Air Cooled VPXThe VPX CUBE features 4 slots of 3U VPX on a 1″ pitch high bandwidth backplane and an integrated, wide temperature range 400 Watt power supply. Contact factory for appropriate board configuration based on environmental requirements. The 53xxx Series mounts one XMC module on a 3U VPX carrier with a flexible crossbar switch. ] Air-over-conduction design. Conduction Cooled Industrial-40°C +70°C-55°C +100°C: Operating Humidity Range: Up to 95% (non-condensing) EMC: FCC 47CFR Part 2 EN55022:2010 Equipment ClassB. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. This dual-port Ethernet XMC card is designed and tested to VITA 47 environmental standards for air-cooled or VITA 20. NXP (formerly Freescale) QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX Single Board Computer (SBC) The XPedite5970 provides a rugged, feature-rich processing solution that maximizes the performance-per-watt capabilities of a Power Architecture®-based processor module. Conduction-Cooled Assemblies (CCA) adaptor (EuropacPRO/-rugged, VPX/CompactPCI) *The price shown is the per piece price and does not include VAT. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. 3 V. 625 IN : Model Number:2. The COOL-CC3 chassis is a 6-slot, 3U, VPX, forced-air, conduction-cooled portable tower chassis ideal for lab development. A brief low intensity electric current is applied to individual nerves, with recording. 3. The VX305C-40G is also available with a VITA 48. Processor and memory chips tend to generate the most heat, with new processors drawing up to 200 watts at maximum functionality. -40 - 85°C (Conduction Cooled) Capture only. Revolutionary design allows for up to 175 watts per slot of conduction cooling. 14 Slot VPX Conduction-Cooled System with Air Assist. 11 12 V 3. Read the full article hereHartmann’s VPX Power Supplies are built for the most rugged applications with quality and reliability in mind. Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. 3U VPX Form Factor, 1” Pitch (conduction cooled) 4, or 8 Lane (factory configured) PCI Express 3. Up to. air cooled, conduction cooled, liquid cooled and spray cooled boards. 0 port is routed per VITA 42. 100 Ohm differential pair routing. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. Cooling: Conduction cooled. The LoC3U-510 is intended for high performance VPX systems where aggregate payload power exceeds 600W. 8 in. DECISIVE PERFORMANCE. ANSI/VITA 48. 85 and 1 in. Part of our LoC3U-500 Series of liquid cooled enclosures, the LoC3U-510 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX conduction cooled systems. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. WOLF carrier boards are designed to provide system designers with a flexible, highly configurable PCI Express interface. Related links and. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. 4 mm Compliant with the VITA 78 SpaceVPX standard For lab variant: Air-cooled metals For flight variant: Conduction-cooled metals Up to 12 Rx/Tx mid-board fiber transceivers System Manager FPGA For lab variant: ACT-H3KI-CG624: ProASIC3: A3PE3000-2FG896iPCI-SYSTEMS Inc. The 3U VPX to PCIe Adapter acts as a PCIe switch, providing an electrically and mechanically optimized interface between PCIe boards and VPX systems. Both XMC and PrPMC interfaces are active simultaneously. 3U VPX Board - 1 x8, 2 x4, 4 x2 PCIe. 0 in. 62H. Frame has injector/ejector latches for plug-in card. Our AoC chassis are designed for mission critical defense applications in the most extreme. or 1. The XChange3030 provides six backplane 40GBASE-KR4 Ethernet ports, six backplane. Eight 6U VITA 48. , November 2023 – Elma Electronic now offers the NetKit-3110, based on the Cisco. NXP (formerly Freescale) QorIQ T2081, T1042, or T1022 Processor-Based Conduction-Cooled XMC/PrPMC Mezzanine Module. Utilizing our extensive experience in embedded. or 1. 0 in. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. "The conduction cooled 3U VPX CUBE is extremely rugged and reliable for military and aerospace applications where system size, weight, and power are critical, and high performance capability is demanded," says Barry Burnsides, Dawn VME Products Founder and CEO. PXI Express Chassis Systems. conduction cooling. The XPedite2570 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Kintex® UltraScale™ family of FPGAs. AFT for VPX is supported with variations (“dot specifications”) through VITA 48. VPX™ interface- OpenVPX™ VITA 65 MOD3-PAY-2F2T-16. Air and conduction cooled options; Made in the USA; New products aligned with SOSA™ Technical Standard; VxWorks, Linux, and Windows support. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. nVent SCHROFF offers you a wide range of Card Lok, Conduction Cooling and VPX Chassis. The logic-optimized FPGA is well. The versatile design allows multiple customizable configurations based on proven components and design techniques. The VPX base standard defined in VITA 46 is a scalable module and backplane technology designed specifically for high speed, critical embedded systems. Features. The XChange3031 provides one backplane 40GBASE-KR4 Ethernet port, six backplane 10GBASE-KR. 1940000519-9001R 3U VPX Extender 3U for conduction cooled boards in conduction cooled chassis VITA 67. Elma’s latest 6U VPX load board comes in a conduction-cooled format as per the IEEE standard 1101. A momentary push button is provided for reset, and a switch is. 1-2201-compliant conduction-cooled 3UVPX carrier card . conduction-cooled heatframes are mechanical assemblies which perfectly match the component topography & requirements of a pcb intended for an embedded computing. This design and development were by MSS, including all the Windows-based software and qualification to full DO-160. Hartmann Electronic power supplies are designed for extreme environmental and demanding electrical conditions for various applications which are based on PICMG 2. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. 0 Reviews. 1 * Kintex® UltraScale™ FPGA. The development kit includes the cables needed to connect the XPand6200. 0) is a widely adopted VPX-based standard which builds on the great success VME systems have had in this arena. 3U VPX (OpenVPX Compliant) Environmental Specifications Temperature Limits. However, as module power continues to increase, VITA 48. Aisle Containment. However, as module power continues to increase, VITA 48. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. VITA 62 Compliant 3U VPX power supply. Failure to observe proper handling and installation procedures can6U, conduction-cooled VPX modules. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. 11. In support of a variety of test functions, the DK3’s open. (H) Four 0. 0 port is routed per VITA 42. e. The board supports tunable bandwidths from 200 kHz to 56 MHz over a frequency range from 70 MHz to 6 GHz. VPX 3U. 0 in. 3V, 5V, +12V_Aux, -12V_Aux & 3. It features a FMC+ slot. 3U conduction-cooled VPX Ethernet router. 2 mechanicalformat. Environment: Extended Temperature, Extended shock & vibration : Height: 10. The adapter includes a PCIe switch chip. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. Verifies chassis can meet power requirement and specifications for VPX. The Atom™ E3800 processors provide excellent computational performance and I/O functionality for. 1 compliant cPCI, 2 through 8 slots, 32 bit or 64 bit configurations, +5VIO or +3. The chassis can accept a front and a rear module. The heat from the internal conduction-cooled modules is. The XPedite7672 is an optimal choice for computationally heavy applications. 6"W x 9. Compare Products. Our Card and Software Packages are Designed for Fast, Portable Integrations. 6U Board with aluminum heatsink. Advanced. Alignment keying headers provided for extender and plug-in card. 8-inch and/or 1. Compare. 2 conduction cooled 6U VPX module with 1 inch pitch : • 6Ux160mm form factor as defined by IEEE 1101. MIL-STD-704F compliant except 50mSec holdup provided by separate module. One high-speed link on VPX-P1(control plane) Up to twelve high-speed linkson VPX-P1. As part of our AoC, air over conduction cooled ATR line, the 810 is designed to maintain safe operating temperatures for high power 3U VPX and SOSA. 11 monitoring and control Input voltage reverse‑polarity protection Remote voltage sensing for +12V and +3. The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Virtex-7 family of FPGAs. These rugged power supplies are available in 200W-1300W power configurations. Cooling air flows directly over the board. EIZO. 2 Type 2, Secondary Side Retainer. 2 (REDI) )0 inch pitch conduction cooled payload slots in Long format (# of slots in Short format TBD) Configurable rigid front I/O PCBA and 7. The DK3 supports VPX development and integration activities for high speed C4ISR (Command, Control,. CCG-6860 Conduction Cooled Card Guide. Contact Us. This enables the VX305H-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. FPGA Resources. Extreme Engineering Solutions (X-ES) is the first to ship OpenVPX™ compliant 3U development systems: XPand1200, a development platform for conduction-cooled modules, and XPand1300, a development platform for air-cooled modules. The IC-INT-VPX3e is a powerful OpenVPX 3U Single Board Computer (SBC) based on the Broadwell-DE processor – 14nm High Performance Chip of Intel’s Low Power Spectrum. Today’s designs must be. View product. This chassis family is part of the industry leading Atrenne, a Celestica company, product line of high. VITA 62 power connector. 0 in. or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. 2 for conduction cooling • VITA 46 board connectors • IEEE 1101. Our selection of Intel, NXP Power. Air (Convection) Cooled – ANSI/VITA 48. Standard heatframe components provided represent a high<br /> performance Thermo-Mechanical design, and reduces engineering and<br /> fabrication costs associated with customization. 2, “Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX”, developed by VITA, defines the mechanical requirements that are needed to ensure the mechanical interchangeability of air-cooled 3U and 6U plug-in units and define the features required to achieve two level maintenance compatibility. High Performance Embedded Computing. 8 in. 8 Air Flow Through Cooling; Powerful push-pull cooling of front cards. The open frame concept offers enhanced flexibility, with fast conversion between air and conduction cooled module guides and fast backplane replacement for easy reconfiguration in support of. The XPand1303 is a low-cost, flexible, development platform. 2: Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX. 2 and stretch the limits at the. operatiNG temperature 0°C to +55°C Air-Cooled; -40° to +85°C Conduction-Cooled staNDarDs Open VPX MOD3-SWH-2F24U module usable in SLT3-SWH-2F24U-14. Reconfigurable. In some ways, AFT is a hybrid between air and conduction cooling, but with greater cooling capability. It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5. It is designed to maintain power to critical systems during short interruptions or voltage fluctuations in the main power source. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). Conduction cooled version: -40°C to +75°C at wedge locks (+85°C optional) Air cooled version: -40°C to +75°C Storage Temp. 2) modules. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling and to an attached cold plate by conduction cooling. Signal rate: 3. Conduction-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector. 3 V. The chassis is also designed for plug in cards in alignment with the SOSA technical standard. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. View. 1/2 ATR, conduction-convection cooled. Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. The high-performance VX305H-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. 0 in. 1 ATR platform with liquid cooled side walls, 6U conduction cooled boards, 1” pitch, per VITA 48. Abaco Announces Production of. or 1. Item/Part Number: 1940000376-0000R Product Features. 3 Slot to 5 Slot each. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. pitch with Two-Level Maintenance (2LM) support; Environmental Requirements. Alignment keying headers provided for extender and plug-in card. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module The XPand1202 provides a low-cost, flexible, VITA 67 development platform. The XPand1201 is a low-cost, flexible, development platform. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. It also supports dual Gigabit Ethernet, GPIO, I²C, XMC I/O, PMC I/O. 3U Open VPX power supply Conduction cooled I 2 C IPMI 46. View. New mobile-class OpenVPX products augment Mercury's server-class and GPGPU building blocks providing latest processor technologies for embedded real-time applicationsMechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. 2 based. Conduction-cooled, rugged 3U VPX form factor. Go-No-Go indicators for 12V, 3. Author: Reggie. Talk to a Hartmann representative today about compliance and your power needs. 8 in. The high-density components that enable high-speed I/O also use more power, making advanced cooling methods essential for rugged VPX designs. The XChange3031 is a conduction-cooled 3U VPX Ethernet switch module. It features dual 9 slot backplanes including PSU slots. 2 conduction cooled modules and VITA 67. Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX. PSC-6236 Product Datasheet. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. 1) modules. The XPand1010’s design eliminates card cages, rear transition modules, and large noisy fans. or 1. Form Factor: 3U VPX. Extremely robust, bullet proof design ♦ Fully integrated power supply, backplane, I/O in one box ♦ 4-Slots of 3u VPX on 1” pitch (OpenVPX Ready) ♦ Full environmental sealing per DO-160E ♦ Vita 48. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. Compatible with Dawn’s HLD-6262 Holdup Module. 0 in. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Up to 20 CFM of airflow is provided per slot. Spare Power Supplies for W-IE-NE-R NIM and CAMAC chassis, providing high power density and low ripple and noise. 3V, 5V, +12V_Aux,State of the Art Power Technology VPX Power Supply. The module utilizes Vicor proprietary technology to enable high efficiency and power density for this highly rugged, conduction-cooled model. Horizontal air-flow cools over 150W per slot to support state-of-the-art processor boards. Hover over a product and select Compare to add to comparison set. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. A network-attached Flyable Data Loader (FDL). AoC3U-410 Conduction Cooling with Air Assist. comThe VTX994 is a single slot 6U VPX chassis for board bring-up and testing of conduction cooled 6U VPX modules. The liquid-cooled chassis sidewalls will. The XChange3031 delivers full wire-speed across all of its ports and supports jumbo frames up to 10 kB. RuSH controlled power and cooling supports high current demands and corresponding high cooling. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. 87"W x 3. The 3U VPX XMC Carrier is a rugged conduction cooled single slot 3U VPX XMC Carrier that can connect one XMC module to a standard VPX backplane using PCIexpress 1x 8lane or 2x4 lane configurations. VPX Extender Cards Product Datasheet. The XChange3031 provides one backplane 40GBASE-KR4 Ethernet port, six backplane. DECISIVE PERFORMANCE. U-Blox), or secure SAASM M-Code GPS receiver. (VPX / cPCI/ VME) and custom designs. The XChange3012 supports an. The PCIexpress bus extention kit permits a host CPU to expand its available PCIe slots. It supports up to two 0. 3 V. Part of our AoC3u-600 Series of rugged packaging solutions, the AoC3U-610 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX and SOSA aligned conduction cooled systems. 2775 Laurel Street Vancouver, BC V5Z 1M9. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. Dawn created the “CUBE” family of enclosures to address the needs of the UAV market. 3V_Aux. pitch without solder-side cover; 0. Data Plane. Our expertise also includes VITA 66, VITA. American National Standards Institute, VITA Standards Organization. Ports: OpenVPX 3U Switch slot profile: SLT3-SWH-2F24U-14. or 1. (W) x 5. 3U Conduction cooled models available on 1″ form factor. 6U VPX Load Board, conduction-cooled 6U x 160mm, conduction-cooled . It provides one XMC/PMC site, alternately used as a PCIbus 32-bit/66 MHz or as an XMC site with either a x4 or a. 3U VPX Rugged conduction-cooled Processor Board; Up to 6 -core Intel ® Xeon ® E-2276ME processor; Up to 32 Gbytes DRAM with built in error correction;. High-Performance 3U VPX Connectivity. 3 to the P15 connector for interfacing with the host module. A onboard DC/DC converter. 8 standard looks to reduce the dependence on conduction cooling for 3U and 6U circuit cards with VPX connectors. Power Supplies. 2 struggles to dissipate the attendant heat using straight conduction cooling. pitch;. LOWER RISK. 3 V Aux contactus@redrock. 6U VPX Load Board Forced Air-Cooled Enclosure Two-Slot OpenVPX Development Platform IPv4/IPv6 Gigabit Ethernet Switch 4 0 On the Cover. Depending on local conditions, packaging and freight charges might not be included. The chassis can accept a front and a Rear Transition Module (RTM). The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. The 12 slot power and ground backplane supports VITA 48. 0 VPX: Coaxial Interconnect – Base Standard. I designed this 3U VPX 0.